Hybrid Memory Cube (HMC) Module
Hybrid Memory Cube (HMC) represents a fundamental change in memory
construction and connectivity. Utilizing 3D interconnect technology,
HMC integrates the best of logic and DRAM processes into a heterogeneous
package. HMC is constructed with a small logic layer below
vertical stacks of DRAM die connected by through-silicon via (TSV)
bonds. An energy optimized DRAM array provides efficient access to
memory bits via the logic layer.
HMC represents the key to extending network system performance to push
through the challenges of new 100G and 400G infrastructure growth with
the following advantages:
Bandwidth - A single HMC unit can provide more than 15X the bandwidth of
a DDR3 module.
Latency – Provides lower queue delays and higher bank availability with
vastly more built-in responders.
Power — Utilizes 70% less energy per bit than DDR3 DRAM technologies.
Reliability, Availability, and Serviceability (RAS) -Supports functions
such as array and DRAM/LOGIC I/O Interface repair
Physical Footprint — The stacked architecture uses nearly 90% less
physical space than today’s RDIMMs.
to Multiple Platforms — Logic layer flexibility allows HMC to be
tailored to multiple platforms and applications.
High-Performance Memory Comparison
Xilinx Kintex UltraScale board with HMC Module
HiTech Global's Hybrid Memory Cube (HMC) Module
Leveraging form the latest FPGA, memory and High-Speed
connector technologies, the ZR-HMC daughter card provides easy
and high-performance interface to the latest HiTech Global's FPGA
development boards populated by Xilinx Kintex / Virtex UltraScale and
Altera Arria10 / Stratix 10 FPGA devices. The high-speed interface is
done through Samtec Z-RAY
connector offering the lowest profile and highest performance
micro-interposer offered by the industry. The innovative layered design
of the Z-RAY enables 56+ Gbps speeds, up to 3,000 cycles and profile as
low as 0.3mm.
module is populated with one 2GB Micron MT43A4G40200NFAS15 Hybrid
Memory Cube device and two Z-RAY interfaces. Multiple HMC devices may be
chained together to increase the total memory capacity available to a
host. As shown by the below diagram, the "Host" Z-RAY connector
mates with FPGA carrier boards using 16 serial transceivers. The
"Pass-Through" link mates with another ZR-HMC module for increasing the
memory density beyond 2GB.
The ZR-HMC module can mate with other
Z-Ray modules such as CXP, QSFP28, FireFly in order to optical bring data to the HMC chip.
Supported FPGA Platforms
(front panel Interface)
Part Number: HTG-ZR-HMC
The openHMC Controller