12x14G FireFly Module (12Tx and 12Rx)
The FireFly™ Micro Flyover System™ is the first interconnect system that gives designers flexibility of using micro footprint optical and copper interconnects interchangeably with the same connector system.
The FireFly™ system enables chip-to-chip, board-to-board, on-board and system-to-system connectivity at data rates up to 28 Gbps (14Gb on this module with 28G in development). FireFly™ is based on a high performance interconnect system which allows the use of low-cost copper cables or high performance active optical engines.
Samtec copper, equalized copper, and optical cable systems provide the flexibility to achieve higher data rates and/or greater distance needs while simplifying board design and enhancing performance.
The ECUE Ribbon Coax Cable features
The ECUO Active Optical Cable assembly features
The module uses high-performance ZRAY port interfacing to Xilinx and Altera FPGAs.
Z-Ray® micro array interposer is ultra-low profile, high density, highly customizable compression contact arrays used as interposers or as board level interconnects. Compared to standard interposers, they feature greater density, X-Y-Z axes flexibility, customizable shapes and patterns, increased cycle life, low normal force with high deflection range and 28+ Gbps performance. HiTech Global is using Z-Ray connectors in conjunction with high-speed serial transceivers (up to 14Gbps) of FPGAs for daughter card and board-to-board interfaces. The HTG-ZRAY bus provides the most optimized performance and the best signal integrity.
Supported FPGA Platforms